Principal Engineer - HBM SOC Design and Integration - TPG

Richardson, TX, United States

Micron Technology

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Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Our Opportunity Summary:

Welcome! The High-Performance Integrated Group (HIG) is a division within the Technology and Products Group (TPG) We are dedicated to developing and optimizing High Bandwidth Memory (HBM) solutions for AI and ML applications. Our ultimate goal is to deliver the lowest power per bit solutions in the industry.

Position Overview:

As a Principal HBM SOC Design and Integration Engineer, you will design and develop next-generation HBM DRAM products. You will collaborate with domain experts and partners to ensure the success of our HBM roadmap. Your deep understanding of SOC Architecture, RTL Logic Design, IP Integration, high-speed interface design, high-performance computing architectures, and 2.5D & 3D package integration will help you identify bottlenecks and propose innovative architectures.

Responsibilities:

  • Analyze customer requirements and specification documents. Work with IP vendors to select off-the-shelf IPs, and modify or custom design new ones if needed.
  • Review architectural specifications and provide constructive feedback to help create high-quality specifications.
  • Implement project results, whether writing specifications, developing RTL, integrating IP, testing code, debugging failures. Run static checks and resolve issues identified by static checks.
  • Identify and flag quality issues, performance problems, and opportunities to reduce power consumption in architecture, microarchitecture, RTL, or circuits.
  • Collaborate with the verification team by reviewing test plans, assisting with writing assertions and coverage monitors. Offer feedback and suggestions for test changes.
  • Debug and identify root causes and solutions for pre-silicon and post-silicon issues encountered in current HBM products and architectures.
  • Engage with customers to support issues with current HBM architectures and find opportunities to innovate on future HBM solutions.

Minimum Qualifications:

  • Proven experience of at least 7+ years in microarchitecture and high-quality RTL development, including writing and testing code in System Verilog.
  • Demonstrated 5 years of experience with SOC integration methods, including DFT/MBIST, CDC, static LP checks, and SOC interconnects, etc.
  • Demonstrated ability automating IP integration using standards such as IP-XACT and tools like Coretools and Defacto, and writing assertions using SVA.
  • Proven expertise in design optimization for performance and low power consumption, including UPF, static timing analysis, synthesis design constraints, and closing timing with logic techniques.
  • Demonstrated track record of innovation and problem-solving in high-performance and/or low power SOC development, with experience delivering highly technical solutions.

Preferred Qualifications:

  • MSEE or higher in Electrical Engineering or a related field.
  • 5+ years of experience with DRAM operation and JEDEC specifications, preferably with the HBM product family, and familiarity with scripting languages such as Python.
  • 3+ years of experience working on IPs such as UCIE, Memory Controller, NOCs, and using NOC generation tools.
  • Proven expertise in some of these areas: memory array architectures, high-speed signaling, physical layer and interface development, power delivery and efficiency optimization, CMOS requirements, packaging, and thermal modeling.
  • Effective communication abilities and ability to build relationships, with a dedication to guiding and nurturing talent. The ability to efficiently synthesize and convey sophisticated technical concepts to partners and leadership. A self-motivated, innovative approach to improving processes or products!

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.  We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.  Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.  Additionally, Micron benefits include a robust paid time-off program and paid holidays.  For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at  hrsupport_na@micron.com or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

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* Salary range is an estimate based on our AI, ML, Data Science Salary Index 💰

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Category: Engineering Jobs

Tags: Architecture Engineering Machine Learning Python Testing

Perks/benefits: Career development Health care Medical leave

Region: North America
Country: United States

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