Yield Failure Analysis Module Engineer

USA - AZ - Chandler, United States

Intel

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Job Details:

Job Description: 

Intel Chandler, Arizona Ocotillo Technology Fabrication (OTF) is part of Intel Foundry's Manufacturing and Supply Chain group (FMSC) and is responsible for the high-volume production of Intel silicon using some of the world's most advanced manufacturing processes. As part of Intel's Integrated Device Manufacturer 2.0 (IDM2.0) strategy with Foundry Capability, Intel Chandler, Arizona site is building new fabs for the latest technology nodes including Intel 18A and beyond. This exciting transformation at Intel needs talented candidates with Yield Failure Analysis experience in Foundry to service local and global customers.

Failure Analysis Engineers in the OTF Yield Department are critical to determining root cause for yield loss and building a strong yield improvement roadmap. OTF Yield is seeking individuals with strong work ethic, diverse background, and broad experience working hands-on with analysis tools to partner with Process and Yield engineers to solve problems.

In this role, the candidate will have the following responsibilities:

  • Conduct failure analysis and root cause determination on the latest technologies and products in high-volume manufacturing at Intel.
  • Generate yield improvement outcomes from the results of the analysis in partnership with Yield and Process engineering.
  • Lead and direct the analysis through various modules of the failure analysis lab - from job submission to reporting the final results and executing corrective action.

The ideal candidate should exhibit the following behavioral traits:

  • Strong work ethic, ownership and drive to achieve results and positive yield/business impact.
  • Skills to function in high-paced ambiguous environment under pressure to produce quality results quickly.
  • Skills to learn rapidly and independently - either in the field of failure analysis techniques or in collaboration with the fab process modules and integrators.
  • Skills to thrive in a diverse and highly technical team setting to solve problems.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Qualifications listed as preferred or additional will be considered a plus factor for applicants.

Minimum Qualifications:

  • Candidate must possess a Bachelor's degree in Electrical Engineering, Physics, Materials Science or related STEM field of study with +5 years of related experience.
  • 1+ years of relevant experience in:
    • Understanding and/or practical experience with semiconductor device physics and contemporary fabrication process technologies.
    • Understanding and/or practical experience with materials, surface and device characterization techniques supporting semiconductor science and manufacturing (such as SEM, TEM, EDX, SIMS, XPS, XRD, FTIR or Auger)
  • Candidate must be willing to travel for training assignments to one of Intel's manufacturing development sites.
  • US citizenship required
  • Ability to obtain and maintain a US Government Security Clearance

Preferred Qualifications:

  • Master's degree in Electrical Engineering, Physics, Materials Science or related STEM field with +3 years of related experience, or a Ph.D. in the previously mentioned areas.
  • Materials and Sample Preparation methods such as polishing, dimpling, wet/dry etches.
  • SEM, FIB, TEM, LSM (electron, ion, photon beam tools) operation and theory.
  • TEM sample preparation.
  • Fault isolation methods such as: Emission Microscopy (thermal, NIR or optical), TIVA/LIVA/OBIRCH/EBIRCH, LVP, LADA, SMI, lock-in thermography etc.
  • Lab bench or ATE testing capabilities for SoC/CPU
  • Hands-on experience with electrical device probing and characterization, particularly with atomic force or beam-based methods after some deprocessing/delayering. This should include the ability to isolate key defective aspects of device and interconnect characteristics and convey the next steps of analysis to the team and customers.
  • Experience or background with semiconductor product EDA tools, CAD navigation, testing platforms and test plans.
  • Skills to design and code automation for lab testing/characterization using modern scripting or software development tools - such as Python, Perl/TCL, JSL, R or similar.
  • Exposure to or strong background using statistical analysis tools such as JMP, SAS, Minitab.
  • Familiarity with latest machine learning tools applied to process and device analysis to accelerate root cause determination.
  • Understanding or training in SoC or CPU microarchitecture and testing.
  • Practical or applied lab research is preferred.
  • Prior experience working with US Government contracts including security and sensitive document handling.
  • Active US Government Security Clearance, with a minimum of Secret level.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Arizona, Phoenix

Additional Locations:

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation.  Find more information about all of our Amazing Benefits here:

https://jobs.intel.com/en/benefits

Annual Salary Range for jobs which could be performed in the US:

$117,140.00-$165,370.00

Salary range dependent on a number of factors including location and experience.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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Tags: CAD EDA Engineering Machine Learning Minitab Perl Physics Python R Research SAS Security Statistics STEM Testing

Perks/benefits: Career development Competitive pay Health care

Region: North America
Country: United States

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