Photonic Integrated Circuit (PIC) Test and Characterization Engineer (Associate or Mid-Level)

Photonic Integrated Circuit (PIC) Test and Characterization Engineer (Associate or Mid-Level)

Company:

The Boeing Company

Boeing Research & Technology (BR&T) is currently looking for a Photonic Integrated Circuit (PIC) Test and Characterization Engineer (Associate or Mid-Level) to join the team based in Huntington Beach, CA.

We are Boeing Research & Technology (BR&T): Boeing's global research and development team creating and implementing innovative technologies that make the impossible possible and enable the future of aerospace. We are engineers and technicians, skilled scientists and bold innovators: join us and put your passion, determination, and skills to work building the future! #TheFutureIsBuiltHere #ChangeTheWorld

Within BR&T, Boeing’s RF, Photonics, and Mixed-Signal Microsystems organization (RPMM) performs microelectronics and photonics technology development for aerospace systems. RPMM develops cutting-edge components including digital, analog, and RF Systems on Chip (SoCs), as well as Photonic Integrated Circuits (PICs) for radar, navigation, electronic warfare, communications, processing, sensing, and other critical functions. These systems are used on Boeing airborne, terrestrial, and satellite platforms. Designs leverage state-of-the-art semiconductor and photonic process technologies. While RPMM utilizes external wafer fabrication services, it executes the whole development flow in-house including architecture definition, design, layout, verification, packaging, and testing. RPMM owns numerous projects funded by internal Boeing programs and external U.S. Government Science and Technology (S&T) customers.

Currently, RPMM is actively hiring a Photonic Integrated Circuit (PIC) Test and Characterization Engineer (Associate or Mid-Level). We are seeking an early-career engineer (holding a B.S. degree + 2 years of experience or a M.S. degree) with a primary focus on the hands-on testing and characterization of Photonic Integrated Circuits (PICs). A key area of focus will be the testing and characterization of devices incorporating on-chip fully integrated lasers. While the primary focus is testing, a foundational understanding of PIC design principles is valuable for effective collaboration and data interpretation.

Position Responsibilities:

• Develop and document comprehensive test plans for PICs based on device specifications and performance requirements
• Set up, configure, calibrate, and operate optical and electrical test equipment, including tunable lasers, optical power meters, optical spectrum analyzers (OSAs), BERTs, probe stations, semiconductor parameter analyzers (SMUs), oscilloscopes, etc
• Perform hands-on electrical and optical characterization of PICs at wafer-level and/or chip-level
• Characterize passive and active photonic components such as waveguides, couplers, modulators, photodetectors, and specifically, on-chip integrated lasers (measuring parameters like L-I-V curves, spectral characteristics, RIN, linewidth, modulation response)
• Develop and utilize test automation scripts (e.g., using Python, LabVIEW, MATLAB) for efficient data acquisition and equipment control
• Analyze test data, generate detailed characterization reports, summarize key findings, and present results to design and engineering teams
• Troubleshoot issues with test setups, equipment, or device measurements
• Collaborate closely with PIC design engineers to understand device functionality, provide test feedback, and contribute to design-for-test considerations
• Maintain laboratory test equipment and adhere to safety protocols

Basic Qualifications (Required Skills/Experience):

• Bachelor of Science degree from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), chemistry, physics, mathematics, data science, or computer science
• This position requires the ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship
• Master's degree in a relevant field OR a Bachelor's degree (as specified above) with 2+ years of relevant experience in optics, photonics, or semiconductor device testing/characterization
• Fundamental understanding of optics, photonics principles, and semiconductor device physics
• Hands-on experience with common optical and electrical test and measurement equipment (e.g., light sources, power meters, oscilloscopes, SMUs)

Preferred Qualifications (Desired Skills/Experience):

• PhD or Master's degree with 3+ years relevant experience with a focus on Photonics, Optoelectronics, or Applied Physics
• Direct experience in testing and characterizing Photonic Integrated Circuits (PICs)
• Specific experience with the testing and characterization of on-chip integrated lasers (e.g., DFB lasers, tunable lasers, SOA-integrated lasers)
• Experience with wafer-level optical probing techniques and equipment
• Proficiency in programming/scripting for test automation and data analysis (e.g., Python, LabVIEW, MATLAB)
• Experience analyzing measurement data and correlating results with device design and simulation
• Familiarity with PIC design concepts and related software tools (e.g., Synopsys-Optocompiler, RSost, Lumerical, KLayout, or EDA tools for layout viewing like Cadence Virtuoso)
• Experience working effectively in a laboratory environment
• Strong documentation skills and clear verbal/written communication abilities

Relocation:

This position offers relocation based on candidate eligibility.

Drug Free Workplace:

Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies.

Shift Work Statement:

This position is for 1st shift.

Pay & Benefits:

At Boeing, we strive to deliver a Total Rewards package that will attract, engage and retain the top talent.  Elements of the Total Rewards package include competitive base pay and variable compensation opportunities. 

The Boeing Company also provides eligible employees with an opportunity to enroll in a variety of benefit programs, generally including health insurance, flexible spending accounts, health savings accounts, retirement savings plans, life and disability insurance programs, and a number of programs that provide for both paid and unpaid time away from work. 

The specific programs and options available to any given employee may vary depending on eligibility factors such as geographic location, date of hire, and the applicability of collective bargaining agreements.

Pay is based upon candidate experience and qualifications, as well as market and business considerations.  

Summary pay range for Associate: $85,850.00 - $116,150.00

Summary pay range for Mid-Level: $104,550.00 - $141,450.00

Language Requirements:

Not Applicable

Education:

Bachelor's Degree or Equivalent

Relocation:

This position offers relocation based on candidate eligibility.

Export Control Requirement:

This position must meet export control compliance requirements. To meet export control compliance requirements, a “U.S. Person” as defined by 22 C.F.R. §120.15 is required. “U.S. Person” includes U.S. Citizen, lawful permanent resident, refugee, or asylee.

Safety Sensitive:

This is not a Safety Sensitive Position.

Security Clearance:

This position requires the ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim and/or final U.S. Top Secret/SCI Clearance Post-Start is required.

Visa Sponsorship:

Employer will not sponsor applicants for employment visa status.

Contingent Upon Award Program

This position is not contingent upon program award

Shift:

Shift 1 (United States of America)

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