Senior Electrical Engineer - Advanced Semiconductor Packaging and Integration

Who We Are

Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to work beyond the cutting-edge, continuously pushing the boundaries of science and engineering to make possible the next generations of technology, join us to Make Possible® a Better Future. 

What We Offer

Salary:

$152,000.00 - $208,500.00

Location:

Santa Clara,CA

At Applied, we prioritize the well-being of you and your family and encourage you to bring your best self to work. Your happiness, health, and resiliency are at the core of our benefits and wellness programs. Our robust total rewards package makes it easier to take care of your whole self and your whole family. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. 

You’ll also benefit from a supportive work culture that encourages you to learn, develop and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more about careers at Applied.

Key Responsibilities

• · Electrical Design and Development: Support the design and development of advanced semiconductor electronics and ASICs, ensuring high performance and reliability.

  · Mixed-Signal Design: Support mixed-signal designs, balancing analog and digital circuit requirements.

  · Semiconductor Processing: Contribute to semiconductor processing and advanced packaging technologies to enhance device performance and manufacturability.

  · I/O Routing Design: Design and optimize I/O routing for high-speed data transfer, ensuring minimal signal loss and interference.

  · Routing Constraints Exercises: Perform routing constraints exercises to ensure compliance with design specifications and industry standards.

  · Chiplet Integration: Implement chiplet integration techniques, focusing on high-speed chiplet I/O and interconnects.

  · Signal and Power Integrity: Ensure signal integrity and power integrity throughout the design and development process.

  · Fully-Integrated Substrate/Interposer Design: Design fully-integrated products using glass, organic, or silicon substrates/interposers, ensuring high performance and reliability.

  · IC Packaging and PCB Layout: Support the design of integrated circuit (IC) packaging and printed circuit boards (PCBs) with a focus on performance, reliability, and manufacturability.

  · Simulation Tools: Utilize industry-standard PCB layout and simulation tools to streamline design workflows and ensure optimal performance.

  · Collaboration: Collaborate with cross-functional teams to ensure seamless integration and timely delivery of projects.

  · Culture: Foster a culture of continuous learning and innovation.

Functional Knowledge

• Demonstrates conceptual and practical expertise in own discipline and basic knowledge of related disciplines

Business Expertise

• Has knowledge of best practices and how own area integrates with others; is aware of the competition and the factors that differentiate them in the market

Leadership

•  Acts as a resource for colleagues with less experience; may lead small projects with manageable risks and resource requirements

Problem Solving

• Solves complex problems; takes a new perspective on existing solutions; exercises judgment based on the analysis of multiple sources of information

Impact

• Impacts a range of customer, operational, project or service activities within own team and other related teams; works within broad guidelines and policies

interpersonal Skills

• Explains difficult or sensitive information; works to build consensus

Requirements:

· Education: M.S in Electrical Engineering, Computer Engineering, or a related field.

· Experience: Extensive experience in advanced semiconductor electronics, ASIC design, mixed-signal design, chiplet integration, and PCB design.

· Technical Skills: Proficiency in semiconductor processing, high-speed chiplet I/O routing design, signal integrity, and power integrity.

· Packaging Technologies: Strong knowledge of advanced packaging technologies, including chiplet integration.

· Chiplet Integration: Experience with chiplet integration, high-speed chiplet I/O, and interconnects.

· SI/PI Expertise: Expertise in signal integrity, power integrity, and automated chip layout generation.

· PCB and Thermal: Experience in PCB design and thermal simulations.

· Collaboration: Ability to work collaboratively in a fast-paced and dynamic environment.

Preferred Qualifications:

· Advanced Education: M.S. or Ph.D. in a relevant field.

· Industry Tools: Experience with leading industry-standard design and simulation tools.

· Leadership Skills: Excellent collaboration and communication skills.

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 25% of the Time

Relocation Eligible:

No

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.