3DIC Yield Analytics & Diagnostics Engineer
Hsinchu City, Hsinchu City, Taiwan
TWD 504K-600K (estimate) Mid-level Full Time
Tasks
- Analyze diagnostics datasets to identify failure mechanisms
- Cluster failures and decompose root causes
- Conduct TSV interposer and 3D stack failure analysis
- Correlate diagnostics with process design and packaging factors
- Develop yield analytics methodologies for 3DIC data
- Drive structured root cause analysis and validation
- Lead 3DIC yield analytics initiatives
- Perform memory diagnostics bitmap analysis
- Perform scan diagnostics and ATPG analysis
Perks/Benefits
- N/A
Skills/Tech-stack
ATPG | Bitmap Analysis | Cause analysis | Clustering | Data Analysis | Data Modeling | Defect Modeling | Diagnostics | Failure Mechanism Analysis | Machine Learning | Mechanism analysis | Memory diagnostics | Process Correlation | Root Cause Analysis | Root cause | Semiconductor Data Analysis | Semiconductor data | Yield analysis
Education
Bachelor of Engineering | Bachelor of Science | Master of Science | PhD
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