Internship in Digital Twin software for Additive Manufacturing

Internship in Digital Twin software for Additive Manufacturing

Description -

HP's 3D Software Organization's Digital Twin group is searching for multiple ambitious, talented research interns to join in our journey to revolutionize digital manufacturing. These research interns will become core members of a research project that applies modeling and simulation to analyze and predict the physical processes in our polymer and metal 3D printing system, and predict the functional outcome.

They will be under close guidance of Digital Twin Group engineering staff (an elite team of PhDs covering expertise from computer science, computational physics, machine learning and mechanical engineering), and in collaboration with our Polymer and Metal 3D Printing and Digital Manufacturing product engineers, develop and implement numerical methods (e.g., finite volume, finite elements, machine learning, deep learning) algorithms and apply to solve real-world industrial problem.

An ideal candidate must possess the true spirit of an industrial researcher, willing to work independently and proactively in researching, testing and prototyping software solutions. The candidate should be very comfortable writing C++ code and using a scripting language such as Python.

Responsibilities:
Third or Fourth-year university students who are working in a technical internship role at hp during their study or in summer breaks between university semesters.

Education and Experience Required:
3rd or 4th Year of University student -typically a technical degree specialization.

Must be enrolled in a full time University program during the whole length of the internship (1 year)

Job -

Administration

Schedule -

Full time

Shift -

No shift premium (Mexico)

Travel -

Relocation -

Equal Opportunity Employer (EEO) - 

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

If you’d like more information about HP’s EEO Policy or your EEO rights as an applicant under the law, please click here: Equal Employment Opportunity is the Law Equal Employment Opportunity is the Law – Supplement