Quantum Assembly Engineer
USA - Vermont - Essex Junction, United States
USD 118K-210K Senior-level Full Time
Tasks
- Collaborate with test and systems teams for cryogenic reliability
- Conduct hands on build and debug
- Coordinate process interactions across interconnect teams and substrate assembly
- Define and maintain process flow specifications and traveler flows
- Define assembly schemes for quantum packaging
- Define requirements for high precision alignment and bonding tools
- Develop cryogenic compatible assembly processes
- Develop next generation assembly architectures for scaling qubit systems
- Drive assembly readiness for new technologies
- Enable prototype builds through internal external assembly lines
- Evaluate and select cryogenic compatible materials
- Improve assembly yield and throughput
- Interface with OSATs assembly partners and suppliers to scale processes
- Maintain assembly process flows and integration guidelines
- Optimize processes for low loss signal paths
- Own assembly integration flows
- Perform failure analysis and root cause investigations
- Provide technical updates data analysis and reports
- Reduce defects and alignment failures
- Support hardware bring up validation and debug in cryogenic environments
Perks/Benefits
- N/A
Skills/Tech-stack
Advanced packaging | Alignment and bonding | Build execution | Cause analysis | Cryogenics | Defect reduction | Design of Experiments | Dilution refrigerator | Electrical and RF engineering | Failure analysis | Flip chip | Flip-chip bonding | Hardware packaging | Hybrid bonding | Interposer integration | Materials evaluation | Microwave engineering | Photonic integration | Process Development | Process Integration | Prototype build | Prototype build execution | Prototyping | Quantum hardware | Quantum hardware packaging | RF Engineering | Root Cause Analysis | Root cause | Superconductivity | TSV integration | Underfill | Wafer-level packaging | Yield Optimization
Education
Regions
Countries
States
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