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4 results
for TSV
(Skill/Tech stack)
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Entry-level Full TimeKerala, Thiruvananthapuram, India20d ago
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Quantum Bump Integration Engineer USD 98K-176K2 5D | 3D integration | BEOL Processing | Bonding | CMPSenior-level Full TimeUSA - Vermont - Essex Junction, …20d ago
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2.5D Integration | 3D integration | Bump bonding | Cause analysis | Cryogenic engineeringSenior-level Full TimeUSA - New York - Malta, …20d ago
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Quantum Superconducting Materials Engineer USD 143K-247KBonding | Bumps | CTE mismatch | Characterization | CryogenicsSenior-level Full TimeUSA - New York - Malta, …20d ago