PhD scholarship in Streamlining quantum chip packaging through 3D printed self-alignment structures - DTU Nanolab

Tasks

• Analyze experimental data
• Characterize topology and mechanical properties
• Design self alignment structures for PIC packaging
• Fabricate self alignment structures using two photon polymerization
• Micro 3D print self alignment structures
• Publish scientific results
• Supervise and teach BSc and MSc projects
• Test packaging performance of fabricated structures

Perks/Benefits

• Academic freedom
• International research environment

Skills/Tech-stack

3D Printing | Experimental Characterization | Integrated Circuit Packaging | Materials Interplay | Materials Science | Materials Topology | Materials modeling | Mechanical Engineering | Mechanical Property Characterization | Mechanics modeling | Micro 3D Printing | Multiphysics Modeling | Photonic Integrated Circuit Packaging | Photonic integrated circuit | Solid Mechanics Modeling | Solid mechanics | Topology | Two Photon Polymerization