Quantum Process Integration Lead (BEOL)

Tasks

• Define and formalise assembly centric fabrication and process development
• Develop integration test plans with cross functional teams
• Enhance flip chip bonding techniques
• Establish scalable documented integration procedures
• Investigate and resolve integration issues and technical anomalies
• Plan and lead back end fabrication and assembly development

Perks/Benefits

• Hybrid work setup
• Learning and development budget
• Open vacation policy
• Pension plan
• Relocation support
• Team events and offsites
• Temporary housing
• Visa support

Skills/Tech-stack

Back End Process Development | Back-end | Bumps | Chip assembly | Design of Experiments | Detachable Contacts | Flip chip | Flow development | Hard Stops | Integration Testing | MEMS | Process Development | Process flow | Process flow development | UBM