Quantum Superconducting Interconnect Integration Engineer
USA - New York - Malta, United States
USD 118K-210K Senior-level Full Time
Tasks
- Architect multi die quantum packaging solutions
- Collaborate with device and test teams on performance
- Define routing metallization integration schemes
- Develop cryogenic interposer architectures
- Develop integration flow documentation and process specs
- Drive process integration planning
- Enable early stage prototyping lots
- Generate technical reports and progress updates
- Identify failure modes and root causes
- Improve yield and manufacturability
- Lead superconducting interconnect and interposer integration
- Own end to end interposer and interconnect integration
- Support cryogenic validation and characterization
- Support transition to manufacturable scalable flows
- Translate system requirements into routing specifications
Perks/Benefits
- N/A
Skills/Tech-stack
2.5D Integration | 3D integration | Bump bonding | Cause analysis | Cryogenic engineering | Design Rules | Film processing | Materials Science | Metal deposition | Microfabrication | Process Integration | Quality Engineering | RDL | RF Microwave Signal | RF/Microwave | Root Cause Analysis | Root cause | Superconductivity | TOV | TSV | Thin film | Thin film processing | Wafer-level processing
Education
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