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Quantum Superconducting Interconnect Integration Engineer

USA - New York - Malta, United States

USD 118K-210K Senior-level Full Time

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Found 1d ago
Tasks
Perks/Benefits
Skills/Tech-stack

2.5D Integration | 3D integration | Bump bonding | Cause analysis | Cryogenic engineering | Design Rules | Film processing | Materials Science | Metal deposition | Microfabrication | Process Integration | Quality Engineering | RDL | RF Microwave Signal | RF/Microwave | Root Cause Analysis | Root cause | Superconductivity | TOV | TSV | Thin film | Thin film processing | Wafer-level processing

Education

Master of Engineering | Master of Science

Roles

Advanced Packaging Engineer | Engineer | Integration Engineer | Interconnect Integration Engineer | Packaging Engineer

Regions

Europe | North America

Countries

Malta | United States

States

New York, US

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