Quantum Superconducting Materials Engineer
USA - New York - Malta, United States
USD 143K-247K Senior-level Full Time
Tasks
- Co optimize materials process and system architecture
- Collaborate with OSATs for integration flows
- Correlate material behavior with device and system performance
- Define and use characterization methods for electrical thermal and structural performance
- Define material stacks and interfaces across BEOL RDL interposers TSV bumps and bonding interfaces
- Develop next generation materials for scalable quantum systems
- Develop optimize and control deposition plating bonding and surface preparation processes
- Develop solutions to improve yield and process robustness
- Develop temperature dependent material property understanding
- Drive long term reliability strategies for cryogenic operation
- Ensure compatibility with process flows tools and downstream assembly
- Establish cryogenic compatible material schemes
- Evaluate materials for electrical thermal and mechanical performance
- Evaluate new materials with suppliers and equipment vendors
- Generate material specifications process guidelines and characterization reports
- Identify analyze and mitigate failure mechanisms
- Integrate materials into 2D 25D and 3D advanced packaging
- Lead external technical engagements and technical consortia
- Lead selection and development of cryogenic and superconducting materials
- Mentor engineers and establish materials selection frameworks and best practices
- Own materials process integration through prototyping and qualification
- Partner with integration teams for scalable manufacturable material choices
- Support IP generation publications and conference outputs
- Track emerging materials and integration schemes
Perks/Benefits
- N/A
Skills/Tech-stack
Bonding | Bumps | CTE mismatch | Characterization | Cryogenics | Deposition | Dielectrics | Electrical Conductivity | Electrical characterization | Electrical resistivity | Failure analysis | Interconnect | Material Science | Mechanical stress | Plating | Process Integration | Quantitative Research | RF Loss | Reliability Engineering | Structural analysis | Superconductivity | Surface preparation | TSV | Thermal characterization | Thermal conductivity
Education
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